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TeraCam 太赫兹相机
TeraCam
商品货号:ECS002835
商品品牌:NeTHIS
详细介绍
TeraCam 太赫兹相机
——Multispectral camera (IR et TeraHertz) of wide field 2D and 3D imaging system
TeraCam is a high performance camera design not only forlaser beam metrology but also for 2D and 3D imaging and Non Destructive Testing of insulating materials(composites, foams, plastics, ceramics...)
NeTHIS offers a versatile and cost-efficient solution formultispectral imaging, dedicated to the largest commercial and laboratory sources in the Infrared, Terahertz and/or MMW electromagnetic domain.
  
The TeraCam relies on a multispectral module (SWIR, LWIR, MWIR, FIR, THz)
implemented on a cooled or uncooled Infrared cores
Key Benefits:
 
High spectral agility (0,1 -> 3000µm ) covering UV, visible, SWIR, MWIR, LWIR and terahertz domains 
-Terahertz 2D imaging on optical domains > 60x60mm
-Terahertz tomography of insulating materials
-Dedicated to a large diversity of coherent and noncoherent sources:
  Solid-states Lasers 
  Fiber Lasers 
  Quantum Cascade Lasers (QCL)
  Molecular Lasers (Excimers, CO2, ...)
  Diodes and electronic terahertz and micro-microwave oscillators  (Gunn, BWO, ...)
  Free electron lasers, black-body radiation   
-Suited for High-power lasers sources
Technical specifications
Parameters
OpenView
TeraCAM
Product size
60*60*300mm3
200*200*300mm3
Working Temperature
Room temperature Uncooled IR Detector
Supply voltage
Sector voltage
Plug-in
IEEEI394/Ethernet
Sensitive detection field
700*700mm2
Pixel size
200µm
100µm
Number of Pixels
700*700
Spatial resolution
Millimetre(Diffraction limited)
Spectral range
0.1-3000µm
Minimum measurable signal
<50µW/cm2 per pixel
Acquisition rate
1-10Hz
1-50Hz
 
Applications
Multispectral imaging applied to R&D and industrial applications
 Physical and optical characterization of insulating materials (density, fatigue, humidity, heat diffusion, strain...)
 Millimeter wave global inspection through opaque insulating materials (delamination, crack, mould, materiel inhomogeneity)
*     2D and 3D penetrating imaging of welding, gluing and attached systems 
New applications possibilities for laboratories and industries 
 2D and 3D optical beams imaging and analysis
 TeraHertz and MMW source optimization and alignment (continuous or pulsed)
 TeraHertz Tomography 
 Multispectral source metrology  
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